Xetch®
Xenon Difluoride Etching Systems
Isotropic
etching of silicon using xenon difluoride is an ideal solution
for releasing MEMS devices. XeF2 shows nearly infinite selectivity
to silicon over almost all standard semiconductor materials
including
photoresist, silicon dioxide, silicon nitride and aluminum. Being
a vapor phase etchant, XeF2 avoids many of the problems typically
associated with wet or plasma etch processes. For more information
see our summary on the unique advantages of xenon difluoride
etching.
XACTIX offers a wide range of xenon difluoride etching systems:
System |
Maximum Substrate Size |
Expansion Chambers |
Maximum
Number of XeF2 Cylinders |
Maximum
XeF2 Quantity
|
Gas Delivery Speed |
Integrated Temperature Control |
Pulsed Etching Mode |
Continuous Flow Etching Mode |
Microscope |
Typical Customer |
Integrated Fume Hood |
e1 |
150 mm Dia. |
1 |
1
|
0.6
kg
|
Low |
Optional |
Included |
Optional |
Optional |
Universities & Research Facilities |
Included |
X3B |
150 mm Dia. |
2 |
2
|
4
kg
|
High |
Included |
Included |
Optional |
Included |
Industrial & Large Universities |
Included |
X3C |
200 mm Dia. |
2 |
2
|
4
kg
|
High |
Included |
Included |
Optional |
Included |
Industrial |
Included |
X3M |
150 mm Dia. |
2 |
2
|
4
kg
|
High |
Included |
Included |
Included |
- |
Industrial |
Included |
XT |
370 mm x 470 mm |
2 |
2
|
4
kg
|
High |
Included |
Included |
Optional |
- |
Industrial |
Included |
 |
e1
Series™ Xetch®
The
e1 Series Xetch is a simple & reliable, low cost
xenon difluoride silicon etch system for universities
who do
not need all of the features of XACTIX’s Xetch® X3
Series. It is ideal for users who have a limited budget,
are part of a smaller group and who are working primarily
with small samples but also need the capability to etch
wafers.
|
 |
X3
(B&C) Series™ Xetch®
The
X3 Series Xetch (X3B & X3C) is the leading XeF2 etch
system for releasing MEMS devices. Its accelerated etch
rates and superior components make it ideal for applications
from intensive R&D to pilot production. |
 |
X3M
Series™ Xetch®
The
X3M Series Xetch etches multiple substrates held vertically
in a wafer boat or similar carrier. This system is primarily
intended for manufacture of devices requiring a complete removal
of exposed sacrifical silicon or other designs which do not
require high uniformity etching across the wafer. |
 |
XT
Series™ Xetch®
The
XT Series Xetch is designed to support larger chambers
while maintaining etch pressures and gas distribution.
It is ideal for etching on glass sheets or for processing
large trays of parts such as packages. |
Last
Updated September 11, 2006
